| 摘要 |
PURPOSE:To prepare a photopolymerizable resin compsn. capable of forming a pattern of polyimide compd. without using any resist by reacting a polyamic acid, obtd. by the reaction of a tetracarboxylic acid dianhydride with a diamine, with an epoxy compd. in the presence of a catalyst. CONSTITUTION:A polyamic acid obtd. by reacting a tetracarboxylic acid dianhydride of formula I (wherein R1 is a tetravalent org. group) with a diamine of formula II (wherein R2 is a divalent org. group contg. a phenolic hydroxyl group) is reacted with an epoxy compd. of formula III (wherein R3 is H, alkyl, or aryl; and R4 is a divalent org. group) in the presence of a catalyst to give a photopolymerizable resin compsn. Because the epoxy compd., contg. a double bond and being polymerizable by irradiation with an active rays such as ultraviolet, visible, electron, and X-rays, is reacted with the polyamic acid, the resulting resin compsn. is stable at room temp. in a dark room, rapidly polymerizes by irradiation with the active rays, and forms a relief pattern of a resin film without using any resist. |
