发明名称 METHOD OF GRINDING OR POLISHING WITH USE OF BLADE AND DEVICE THEREOF
摘要 PURPOSE:To aim at securing operation for cutting and grooving with high accuracy by reciprocating a blade in a machining direction, while turning a sample round, in case of a device cutting and polishing silicon, rock crystal, etc., by its blade. CONSTITUTION:One end of a blade 1 is attached to a block 2 supported slidably by a table 4 and tugged by a bolt 2a and the other end is attached to a rotatable block 3 via a shaft 3b, and tensile force at the upper end of the blade 1 is set larger than that at the lower end. A sample 5 is secured to a chuck 6a and exercises an oscillating motion by the reciprocating rotation drive of a motor 6e. In addition, the blade support table 4 is pivotedly supported with a shaft 9 serving as a fulcrum and connected to the eccentric position of the power shaft of a motor 7 via a crank 8; the blade 1 reciprocates centering on the shaft 9 along a circular arc being driven by the motor 7.
申请公布号 JPS5834752(A) 申请公布日期 1983.03.01
申请号 JP19810050634 申请日期 1981.04.06
申请人 HITACHI SEISAKUSHO KK 发明人 FUJISAWA MASAYASU;OKU TSUNEO
分类号 B28D1/06;B23D51/04;B24B27/06;B28D5/04 主分类号 B28D1/06
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