| 摘要 |
Ungelled resin compsns. contain at least one Si-contg. gp. of formula (I), (II), or (III) where Q= the residue of an organic polyol which is (1) a simple diol, triol or higher hydric alcohol, (2) a polyester polyol, (3) a polyether polyol, (4) amide contg. polyol or (6) a polyhydric polyvinyl alcohol R(independently)= H or C1-10 gp. joined to Si by an Si-C bond Y= an easily hydrolysable gp. provided that the ratio of no. of g of ungelled resin compsn. equiv. of Y is from 40 to 667. A non-aq. compsn comprising (I) is also claimed. The compsns. are useful as coating compsns. adhesives, sealants, inks, etc. The compsns. cure at relatively low temps. pref. within 24 hrs. at 24 deg.C, and avoid using isocyanates.
|
