发明名称 RESIN SEALING DEVICE FOR SEMICONDUCTOR
摘要 PURPOSE:To obtain a sealing device having high reliability by containing integrally a plunger in a sealing mold, thereby facilitating the core matching of a pot to the plunger. CONSTITUTION:A semiconductor element is set to cavities 1, 1',- resin is then filled in a pot 2, a cylinder 7 is then lowered to introduce a plunger 3 into the pot 2. Resin in the pot is press-fitted through a slot 8 into the cavities 1, 1',- thereby sealing the element. The cylinder 7 is removed, and the plunger 3 is reset to the original position via springs 9, 9',-. Since this plunger mechanism is contained integrally in an upper mold, a core matching of the plunger 3 to the pot 3 is completed by guide posts 4, 4',- at the assembling time, and the accurate adjustment of the cylinder 7 to the mold can be eliminated. Since the accuracy of the core matching of the plunger to the pot can be improved, wear resistant lifetime can be remarkably prolonged, and improper molding can be avoided.
申请公布号 JPS58204542(A) 申请公布日期 1983.11.29
申请号 JP19820087312 申请日期 1982.05.25
申请人 TOKYO SHIBAURA DENKI KK 发明人 HOSHINA KIMIO
分类号 H01L21/56;B29B7/00;B29C39/00;B29C39/10;B29C39/24;B29C39/26;B29C45/02 主分类号 H01L21/56
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