| 摘要 |
<p>PURPOSE:To prevent lifetime from being shortened after heat treatment and to prevent a microshallow pit from being produced by light etching operation by a method wherein the surface as a picking-up part of tweezers is constituted of titanium. CONSTITUTION:Tweezers 11 are formed of titanium; their base part 11a is bent and formed to be V-shaped; on the other hand, picking-up parts 11b at their tip are bent and formed to be L-shaped with reference to the base part 11a, the picking-up parts 11b are constituted in such a way that they are situated in a position which is lowered by one step from the base part 11a. Thereby, a drop in lifetime of a semiconductor wafer after heat treatment is small as compared with a case where the wafer is treated with ordinary tweezers; a microshallow pit produced when the surface of the semiconductor water after the heat treatment is light-etched becomes small.</p> |
