| 摘要 |
PURPOSE:To make a plane having a good flatness for the next process fitting an upper insulating film with photosensitive resin and a coil conductor, by leaving the photosensitive resin used for forming the coil conductor pattern as it is. CONSTITUTION:The lower magnetic film 1 and the lower insulating film 4 to be used for forming the gap also are formed on a substrate 9 in each pattern. Then, a foundation metal 10 to be used for electrolytically plating a metal which forms the coil conductor 6 is evaporated on the insulating film 4, and the foundation metal is removed by the photoetching process by leaving parts of it where the coil conductor 6 is fitted by the electrolytic plating. After the photoetching process, a photosensitive resin 8 is applied to eliminate the level difference, and then, the photosensitive resin is removed from the parts where the coil conductor 6 is installed after the resin is exposed and developed so that the resin which occupies the space between the coil conductor can remain. Thereafter, the coil conductor is electrolytically plated until the conductor has the same thickness as of the resin. The upper insulating film is formed on the flat plane formed by the photosensitive resin and the coil conductor. |
