| 摘要 |
PURPOSE:To lead out terminal lead-out wires short at large pitches, by connecting in orders reverse to arranging orders beside the connection by normal outer bonding. CONSTITUTION:Each connecting land 8 of chips 7 and finger leads 10 on films 9 are positioned for inner bonding. Next, positioning is performed so that the wiring 12 of the finger lead 10 and wiring block 11 forms meandering. Then, beside the connection by outer bonding in normal arranging orders, connection is made in reverse orders to mount the plurality of chips 7 on the wiring blocks 11 with the wiring 12 of adjacent wiring block 11 connected by the finger lead 10. |
