| 摘要 |
<p>PURPOSE:To make it possible to take out a wafer readily without contact with neighboring wafers when the wafer is taken out by a constitution wherein a contact part is in perpendicular to or in parallel with the surface of the wafer based on the position of a wafer cassette regardless of the position of a holding part. CONSTITUTION:An angle detector 3 detects an angle at which a contact part 1 is kept in the vertical direction all the time and a reference angle for setting the contact part 1 at an arbitrary angle. An angle detector 8 detects the position of the contact part 1 with respect to a holding part 9. The contact part 1 is operated by the following ways: the contact part 1 is vertical all the time when a wafer cassette and the like containing semiconductor wafers are set at the horizontal position; and the contact part 1 is in parallel with the surface of the semiconductor wafer in the case when the wafer cassette and the like are set at an arbitrary angle. In this way, the wafer can be taken out readily without contact with the wafers at the front and rear parts when the wafer is taken out.</p> |
