| 摘要 |
<p>A semiconductor wafer (14) transport system includes a blade (20) which incorporates electrostatic wafer clamping utilizing interleaved electrodes (42, 44) and particularly, a layer 46 of dialectric material overlaying said electrodes (42, 44) for maximizing the electrostatic clamping force generated between the wafer transport blade (20) and a semiconductor wafer (14) to prevent slippage of the wafer (14) off the blade (20) during blade accelerational movement.</p> |
