| 摘要 |
PURPOSE:To obtain a uniform metallic layer good in solder wetting and bonding connection by providing a junction having a uniform alloy layer comprising gold and metal other than gold on a substrate. CONSTITUTION:A junction formed with a uniform alloy layer comprising gold and metal other than gold is provided on a substrate. For example a base material comprises a ceramic substrate 1 such as of alumina, a conductor 2 such as of W, Cu, nickel 3 and gold 4. The conductor 2 is an end of a wiring part provided on the substrate 1 while nickel 3 and gold 4 form the junction, Then laser light is radiated to the base material via a laser reflection board 7 and a condensing lens 6 to improve the quality of a surface. Thus a metallic layer good in solder wetting and bonding connection can be obtained cheaply. |
