| 摘要 |
PURPOSE:To obtain a high density thick film circuit board having high reliability in adhesive strength to an insulating substrate and a microwiring pattern by specifying composition of copper thick film paste to be a starting material in a thick film etching method. CONSTITUTION:Using a thick film etching method, a component ratio of copper thick film paste shall be as follows: to copper powder 100wt.%, glass frit, wherein borosilicate lead glass mainly composed of PbO 70 to 99wt.%, B2O3 1 to 15wt.%, SiO2 0.1 to 10wt.% contains an additive of ZnO 0.01 to 5.0wt.% and/or TiO2 0.01 to 1.0wt.%, or an inorganic binder 1 to 20 pts.wt. consisting of a mixture of this borosilicate lead glass and ZnO 0.01 to 5.0wt.% and/or TiO2 0.01 to 1.0wt.% and a mixture 2 to 25 pts.wt. of a vehicle and an organic solvent as an organic binder. Thereby, an etching removing property is improved so as to obtain a thick film circuit board excellent in reliability in electrode adhesive strength and having a high density microwiring. |
