发明名称 |
Process for producing a device using a thin layer film structure. |
摘要 |
<p>The invention relates to a process for manufacturing devices incorporating a thin layer film structure, which process makes it possible in particular to not pass on to a first part of the device the effects of certain operations required in manufacturing the second part formed by the thin layer film structure. …<??>To this end, the process of the invention consists in using an intermediate support (13) in order to produce an intermediate assembly (12) comprising the thin layer film structure (11), in then transferring the intermediate assembly (12) onto the first part (10), and in then at least partially removing the intermediate substrate (13). …<IMAGE>… </p> |
申请公布号 |
EP0392907(A1) |
申请公布日期 |
1990.10.17 |
申请号 |
EP19900400951 |
申请日期 |
1990.04.06 |
申请人 |
COMPAGNIE EUROPEENNE DE COMPOSANTS ELECTRONIQUES LCC |
发明人 |
COUTELLIER, JEAN-MARC;JACOBELLI, ALAIN;MAURICE, FRANCOIS;MEUNIER, PAUL-LOUIS |
分类号 |
G11B5/127;G11B5/187;G11B5/23;G11B5/31;H01L21/302 |
主分类号 |
G11B5/127 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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