发明名称 MULTILAYER CONTACT STRUCTURE
摘要 MULTILAYER CONTACT STRUCTURE A method for forming a contact structure on a silicon surface comprises forming a TiSi2 layer in intimate contact with the silicon surface and a TiNxOy layer overlying the TiSi2 layer, and forming an Al alloy layer on the TiNxOy layer. The TiSi2 layer provides a good electrical contact to the silicon surface, the Al alloy layer reduces the contact resistance, and the TiNxOy layer provides a diffusion barrier to prevent interaction of the Al alloy and TiSi2 which could degrade the contact.
申请公布号 CA1275332(C) 申请公布日期 1990.10.16
申请号 CA19880574384 申请日期 1988.08.10
申请人 HO, VU Q. 发明人 HO, VU Q.;YANG, PING K.
分类号 H01L21/285;H01L21/768;H01L23/532 主分类号 H01L21/285
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