Method for producing a tablet for resin-molding semiconductor devices and resin-molding method making use of the tablet

摘要

A resin-molding tablet for use in resin-molding semiconductor devices has a tablet body formed of powdered or particulate resin. The particles of the resin are compacted such as to form voids between adjacent particles. At least the outer peripheral region of the tablet is fused such that the resin particles are welded together to form a continuous layer of fine and impervious structure substantially free of open pores. The internal air trapped in the voids of the tablet is drawn and removed before the tablet is fused so that the tablet is substantially free of air. The tablet is produced by placing a particulate or powdered resin material in a vacuum vessel so as to allow the internal air in the resin material to be drawn outside, and then applying pressure and heat to the resin material so that at least the peripheral region of the mass of the particulate resin is fused to weld together. The tablet thus formed is melted and forcibly fed into a vacuum die cavity in which a semiconductor device to be molded is accommodated, thereby to hermetically seal the semiconductor device. Thus, a semiconductor package having substantially no voids is produced.