发明名称 |
Integrated electrical conducting, cooling and clamping assembly for power semiconductors |
摘要 |
A multiple phase electronic semiconductor package 10 including a stack of electrically conductive plates 12 with two opposed clamping plates 14, at least one interposed semiconductor component 16 and two side plates 18 flanking the stack. The height of the side plates 18 is a predetermined amount less than the combined height of the conductive plates 12 and semiconductor components 16. Threaded fasteners 20 secure the opposed clamping plates 14 to the side plates 18 causing the opposed clamping plates 14 to abut the side plates 18, and thereby creating a specific clamping force between the conductive plates 12 and semiconductor components 16.
|
申请公布号 |
US4963976(A) |
申请公布日期 |
1990.10.16 |
申请号 |
US19880243511 |
申请日期 |
1988.09.12 |
申请人 |
SUNDSTRAND CORPORATION |
发明人 |
FLUEGEL, THEODORE D.;DISHNER, BRYAN W. |
分类号 |
H01L23/473;H01L25/11 |
主分类号 |
H01L23/473 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|