| 摘要 |
PURPOSE:To simplify the assembling of a semiconductor element, a semiconductor element mounting plate, and a lead wire by a method wherein the element is installed on an electron element mounting plate using a conductive binder, and the element is connected to the adjoining plate-type lead. CONSTITUTION:A groove 7, wherein slits 2 and 4, a protrusion 5, a bolt hole 3 and an element position 8 are provided as prescribed, is formed on a flange 1 made of copper and the like, and Ni plating is performed. After silver foil 10 has been cold pressure- welded on a position 8, an Si element 13 is fixed using a conductive binding agent 14. On the other hand, an inner lead 21a, a slit hole 24 and a tab end 25b to be provided at the prescribed relational position with the lead 21a, and an outer lead 21b are provided by performing processing on a thin plate 20 such as phosphor-bronze and the like, and silver plating is performed. Then, the point of tab lead 25a is inserted in the center of a pair of holes 4 of the flange and fixed by caulking using the protrusion 5. The flange main body 1 is placed on a base 34, and the element 13 is thermo-press welded to the adjoining lead 21a through the intermediary of a spacer 33 using a gold wire 10. Lastly, resin sealing 37 is performed and the device is completed. According to this constitution, the assembling work can be simplified, the molding mold is not complicated and this method of manufacture is proved to be fitted for industrialization. |
