摘要 |
PURPOSE:To enable a precise hole boring process correcting a hole boring position by a method wherein a printed wiring board is corrected to be flat, a boring position is measure, and a hole is bored at the boring position. CONSTITUTION:A printed wiring board 1 is corrected to be flat as being pressed by a correcting plate 2, hole boring positions are measured, and then holes are bored in the wiring board 1 at the measured boring positions by a boring tool 3. Therefore, even if the printed wiring board 1 is deformed, measurement can be made after the deformation of the board 1 is corrected. By this setup, a hole boring process can be made precisely correcting a hole boring position. |