| 摘要 |
<p>PURPOSE:To improve workability and reliability by installing a through hole land on the surface of an insulating film, installing an outer lead bonding pad corresponding with the through hole land on the rear, and installing a through hole connecting them. CONSTITUTION:Leads 4b and electric measurement pads 5b are installed on the surface of a film carrier tape 6b. Said pads are arranged in the type of two zigzag rows. On the rear of the tape 6b, a through hole land being an outer lead bonding OLB pad 15 is arranged, on which solder protrusions 13b are formed and connected with the other through hole land being a pad 5b, via a through hole 14b. A unit containing a semiconductor chip 2b and the leads 4b is cut out from the tape 6b, and connected with a bonding pad 12b arranged on a printed board 11b, via a solder protrusion 13b. Thereby the lead of a part subjected to OLB is fixed on the film, so that the deformation of the lead can be prevented.</p> |
