| 摘要 |
PURPOSE:To prevent a reduction in the adhesiveness of an electric circuit by a method wherein a water-soluble particle-containing resin layer is formed between the electric circuit on an internal layer material and/or an external layer material and a prepreg and water-soluble particles in the surface of the resin layer are removed by dissolution. CONSTITUTION:As a water-soluble particle-containing resin, cement, vinyl acelate, starch and the like, for example, of a mean particle diameter of 1 to 10mum are used. A phenolic resin, an epoxy resin or the like is dissolved in a proper solvent and 10 to 1000 parts weight or thereabouts of the solvent is added to 100 parts weight of the resin. As the coating amount of the water-soluble particle-containing resin, an amount of 100 to 400g/m<2> is effective. The resin is sufficiently dried after being subjected to water treatment. Water-soluble particles are removed, a roughness is generated in the surface of the resin and after that, a prepreg is superposed on one surface or both surfaces of an internal layer material and moreover, an external layer material is superposed and the internal and external layer materials, the prepregs, an electric circuit and the resin are integrally formed by a proper pressing and a proper temperature. Even if the width of the electric circuit is fine, the adhesiveness of the electric circuit is not reduced by a rough anchor effect. Thereby, a halo is hardly generated, a high-reliability multilayer board is obtained and a failure is hardly generated in the electric circuit itself. |
