MODUL-AUFBAU MIT INTEGRIERTEM HALBLEITERCHIP UND CHIPTRAEGER

摘要

Module (10) comprises a chip carrier (1) and an integrated semiconductor chip 9 having its contact pads (11), facing the chip carrier, fixed in a recess (5) of the latter. Through a slot (3) in chip carrier (1), contact pads (11 are connected by lead wires (12) to conductors 8 on the top side (2) of carrier (1). The entire module (10) has a height ranging from 0.8 to 1.2 mm and thus permits increasing the packaging density of standard EDP systems. In addition, such modules are more readily producible than DIP modules with molded plastic housings. A module package comprising four such modules has a height that is noticeably less than that of comparable module packages with standard modules. By arranging a plurality of such modules with different chips adjacent to each other, a card may be obtained which as a basic card acts as an identification and/or a credit card.