| 摘要 |
PURPOSE:To improve the yield rate in manufacturing and to improve reliability, by using a room-temperature setting type two-liquid conductive paste, which does not require baking for shrinking the conductive paste after bonding, bonding a semiconductor pellet to a substrate, and packaging the device. CONSTITUTION:A semiconductor pellet 1 and a substrate 4 are bonded by using a room-temperature setting type two-liquid silver paste 2. At this time, the device is stored on, e.g., a clean bench, where an ordinary temperature state and a clean state can be maintained, for ten and several hours after mounting work. Thereafter wire bonding can be performed by using ordinary bonding wire 3. Since the room-temperature setting type silver paste 2, which does not required baking for shrinking, is used, poor bonding at the wire bonding part due to outgassing, which is yielded at the time of hardening of the silver paste 2, and poor baking of organic material and the like on the semiconductor pellet 1 are eliminated. |
