| 摘要 |
<p>Process and apparatus for the removal of patterning material selectively applied to a screen printing stencil according to a pattern, in which a medium is sprayed at high pressure locally against the stencil and the stencil is moved in such a way relative to the spraying point that the entire part of the stencil coated by patterning material is covered. The medium can be water of which the pressure lies in a range between 150 and 300 bar. Preferably the spraying is always carried out oppositely from both sides of the stencil. Further the spraying may take place in a pulsating manner and prior to spraying the stencil may be treated with a weakening medium which weakens the bond between the patterning material and the stencil, while essentially maintaining the bond.</p> |
