| 发明名称 |
METHOD OF FORMING SUPERCONDUCTING WIRES |
| 摘要 |
In the method of forming superconducting wires, a wiring pattern is formed by the lift-off method after depositing a raw material on a masking layer. This enables a masking layer having a fine wiring pattern to be formed by lithography. |
| 申请公布号 |
EP0347470(A4) |
申请公布日期 |
1990.10.10 |
| 申请号 |
EP19890900893 |
申请日期 |
1988.12.23 |
| 申请人 |
MITSUBISHI METAL CORPORATION |
发明人 |
SUGIHARA, T MITSUBISHI METAL CORP CHUO KENKYUJO;MURAKAMI, Y MITSUBISHI METAL CORP CHUOKENKYUJO;TAKESHITA, T MITSUBISHI METAL CORP CHUOKENKYUJO |
| 分类号 |
C01G1/00;C04B41/87;H01B12/06;H01B13/00;H01L21/3205;H01L21/768;H01L23/498;H01L23/52;H01L39/24;(IPC1-7):H01L21/88;H01L39/06 |
主分类号 |
C01G1/00 |
| 代理机构 |
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