发明名称 |
IC card module. |
摘要 |
<p>An IC card mooule includes a substrate 12 one side of which is provided with a connection terminal 7; and a resin-sealed semiconductor IC 11 which has been previously sealed by a resin. This connection terminal and the resin sealed semiconductor IC are electrically connected to each other and are molded with a molding resin 17 in such a manner that they are covered with the molding resin so as to prevent at least the electrically-connected portion 16 between them from being allowed to appear. Accordingly, reliable modules can be efficiently manufactured, and such reliable modules can be readily mounted on IC card substrates.</p> |
申请公布号 |
EP0390996(A2) |
申请公布日期 |
1990.10.10 |
申请号 |
EP19890308034 |
申请日期 |
1989.08.07 |
申请人 |
MITSUBISHI DENKI KABUSHIKI KAISHA |
发明人 |
KODAI, SYOJIRO C/O KITAITAMI SEISAKUSHO OF;OCHI, KATSUNORI C/O KITAITAMA SEISAKUSHO OF;BABA, FUMIAKI C/O ZAIRYO KENYUSHO OF |
分类号 |
B42D15/10;G06K19/077;H01L23/28;H01L23/29;H01L23/31;H01L23/498;H05K3/28;H05K3/34 |
主分类号 |
B42D15/10 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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