发明名称 |
CERAMIC STRUCTURE WITH COPPER BASED CONDUCTORS AND METHOD FOR FORMING SUCH A STRUCTURE |
摘要 |
The ceramic composite structure has copper based conductors being resistant to oxidation and their resistivity is maintained to a value less than about three times the resistivity of pure copper and their melting temperature is maintained to a value greater than the sintering temperature of the ceramic, with the dielectric constant of the ceramic having a value less than about 10. The conductors are composed principally of copper and additives. The method comprises: forming at least one green sheet comprised of a thermoplastic organic binder having dispersed therein particles in particular of glass, said green sheet having a sintering temperature below the melting point of said copper based conductors; forming on a surface of said first green sheet a pattern of oxidation resistant copper based conductor forming composition; superimposing a second said sheet on said surface of said first sheet; laminating said superimposed sheets together; heating said laminate in air to a burn-out temperature; and sintering said laminate in a reducing or inert atmosphere. |
申请公布号 |
EP0312824(A3) |
申请公布日期 |
1990.10.10 |
申请号 |
EP19880116354 |
申请日期 |
1988.10.03 |
申请人 |
INTERNATIONAL BUSINESS MACHINES CORPORATION |
发明人 |
CHANCE, DUDLEY AUGUSTUS;HOUGHAM, GARETH GEOFFREY;GOLAND, DAVID BRIAN |
分类号 |
H05K1/09;H01L21/48;H01L23/13;H01L23/15;H01L23/498;H05K1/05;H05K3/12;H05K3/40;H05K3/44;H05K3/46;(IPC1-7):H01L23/48;H01L23/14 |
主分类号 |
H05K1/09 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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