发明名称 |
Radiation resistant semiconductor structure. |
摘要 |
<p>In a semiconductor device having at least two conductive layers (103-1, 103-2) disposed close to each other on an element isolating insulation film (102) formed on a first P-type region (101), a second P-type region (111) is formed in a region of the first P-type region which is between the two conductive layers. The impurity concentration of the second P-type diffusion region is higher than the first P-type region. A region of the element isolating insulation film which is on the second P-type diffusion region is thin to form a thin insulation film. With the features, no inversion layer is formed in the region of the first P-type region where the second P-type diffusion region is formed. As a result, the inversion layers under the conductive layers will not be in contact with each other.</p> |
申请公布号 |
EP0391420(A2) |
申请公布日期 |
1990.10.10 |
申请号 |
EP19900106547 |
申请日期 |
1990.04.05 |
申请人 |
KABUSHIKI KAISHA TOSHIBA;TOSHIBA MICRO-ELECTRONICS CORPORATION |
发明人 |
HATANO, HIROSHI, C/O INTELLECTUAL PROPERTY DIV.;YOSHII, ICHIRO, C/O INTELLECTUAL PROPERTY DIV.;TAKATSUKA, SATORU, C/O INTELLECTUAL PROPERTY DIV. |
分类号 |
H01L21/76;H01L27/118;H01L29/06;H01L29/78 |
主分类号 |
H01L21/76 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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