发明名称 Radiation resistant semiconductor structure.
摘要 <p>In a semiconductor device having at least two conductive layers (103-1, 103-2) disposed close to each other on an element isolating insulation film (102) formed on a first P-type region (101), a second P-type region (111) is formed in a region of the first P-type region which is between the two conductive layers. The impurity concentration of the second P-type diffusion region is higher than the first P-type region. A region of the element isolating insulation film which is on the second P-type diffusion region is thin to form a thin insulation film. With the features, no inversion layer is formed in the region of the first P-type region where the second P-type diffusion region is formed. As a result, the inversion layers under the conductive layers will not be in contact with each other.</p>
申请公布号 EP0391420(A2) 申请公布日期 1990.10.10
申请号 EP19900106547 申请日期 1990.04.05
申请人 KABUSHIKI KAISHA TOSHIBA;TOSHIBA MICRO-ELECTRONICS CORPORATION 发明人 HATANO, HIROSHI, C/O INTELLECTUAL PROPERTY DIV.;YOSHII, ICHIRO, C/O INTELLECTUAL PROPERTY DIV.;TAKATSUKA, SATORU, C/O INTELLECTUAL PROPERTY DIV.
分类号 H01L21/76;H01L27/118;H01L29/06;H01L29/78 主分类号 H01L21/76
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