METHOD FOR FORMING METALLIC PLATING LAYER IN SPACING OF FUNCTIONAL PATTERN ON SUBSTRATE

摘要

PURPOSE:To accurately form the metallic plating layers in the spacing of the functional patterns on a substrate by forming a hardening film contg. a catalyst for electroless plating on the substrate and forming the functional patterns on the hardening film and subjecting the substrate to an electroless plating. CONSTITUTION:The hardening film contg. the catalyst for electroless plating is formed on the transparent substrate and the functional patterns are formed thereon. The hardening film of only the parts where the functional patterns are not formed, i.e. the spacing parts of the functional patterns is thereupon exposed. Only the catalyst for plating of the spacing parts can come into contact with a plating solution and only the spacing parts are electroless plated by the catalytic effect to form the metal plating layers when the substrate is immersed into the plating solution. The metal plating layers are accurately formed in the spacing parts of the functional patterns in this way.