发明名称 Method for manufacturing multilayer board
摘要 A method for manufacturing multilayer board in which the pulp suspension forming a surface layer (12) is fed onto the horizontal section of a first, inner wire (1). The pulp suspension forming an intermediate layer (11) is supplied onto said web layer, which is already formed, in or in front of a tapering gap (6) constituted by the first wire and a second, outer wire (4). Both of the wires and the web layers (11, 12) between them are guided over a curved surface (3). After this the first wire and both of the web layers are guided against a third wire (8) onto the horizontal section of which the pulp suspension forming the other surface layer (13) is supplied. The consistency of the pulp suspension forming the intermediate layer (11) is remarkably higher than that of the pulp suspensions forming the surface layers (12, 13).
申请公布号 US4961824(A) 申请公布日期 1990.10.09
申请号 US19890298237 申请日期 1989.01.13
申请人 LAITINEN, LEO S.;WARIS, VEIKKO K. T. 发明人 LAITINEN, LEO S.;WARIS, VEIKKO K. T.
分类号 D21F11/04 主分类号 D21F11/04
代理机构 代理人
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