| 摘要 |
PURPOSE:To prevent polishing capabilities from deteriorating in a short period by impregnating a polyester or polyether thermoplastic polyurethane DMF solution into a sheet-shaped fiber base material, wet-coagulating it to temporar ily generate an intermediate composite base material, and processing thermoset ting polyurethane on the composite base material. CONSTITUTION:A polymer solvent solution mainly made of linear thermoplastic polyurethane is impregnated into a felt-shaped fiber sheet, it is then wet- coagulated, thus component fibers are buriedly surrounded in the fiber sheet to form a resin porous body. A composite base material obtained by washing end drying it is impregnated with a solvent solution solved with the resin harder than the thermoplastic polyurethane resin as the secondary processing, it is heated and dried, thereby a semiconductor wafer abrasive cloth with the hard ness JISA 72 deg. or above and the compressibility 7.5% or below is obtained. |
