| 摘要 |
PURPOSE:To improve adhesion between an inner layer material and a prepreg layer by arranging an outer layer material to an outermost layer through a prepreg on a smooth surface of the inner layer material which is provided with a resin layer to a circuit surface and by applying head and pressure for integral formation. CONSTITUTION:Outer layer material 6 is provided on outermost layers through prepreg 5 on the surfaces of smooth inner layer material 2 which is provided with resin layers 4 on the surfaces of a circuit 1 and heat and pressure are applied for integral formation. A material containing phenol resin, epoxy resin polybutadiene resin, etc., which has good characteristics such as heat resistance and humidity resistance and good adhesion can be used for the resin layers 4. The resin layers 4 whose thickness reach the surfaces of the circuit 1 are thus provided on the board surfaces 3 of the inner layer material 2 and is made smooth in this way. Thereby, it is possible to improve interlaminar adhesion between the inner layer material and the prepreg layer greatly and to realize good haloing-resistance. |
