| 摘要 |
PURPOSE:To prevent contact of a bonding wire with a tab and contact between bonding wires by a method wherein an insulating material is installed between a semiconductor pellet and an inner lead, grooves are formed in prescribed positions of the material and the bonding wires are fit into the grooves. CONSTITUTION:An insulating material 1 is installed between a semiconductor pellet 9 and inner leads 4. Accordingly, even when bonding wires 11 are slacked, it is possible to prevent contact of the bonding wires 11 with a tab 8 because the insulating material 1 exists between the bonding wires 11 and the tab 8. In addition, grooves 2 are made at end parts on the side of the inner leads 4 of the material 1; the bonding wires 11 are fit into the grooves 2; accordingly, even when an arrangement interval of the bonding wires 11 is small, a movement of the bonding wires 11 is limited. Thereby, it is possible to prevent contact of the bonding wires 11 with the tab 8 and contact between the bonding wires 11. |
