| 摘要 |
PURPOSE:To obtain a highly productive method wherein a plurality of solder bumps of an integrated circuit chip can be bonded to the respective connection terminals of a substrate simultaneously without the restriction of the substrate on which the connection terminals are formed by a method wherein the respective solder bumps are placed on the connection terminals of the substrate and, in that state, a laser beam is applied to the whole rear surface of the integrated circuit chip. CONSTITUTION:A plurality of external connection pads are formed on the one surface of an integrated circuit chip 1 and solder bumps 4 are provided on the respective external connection pads. After the respective solder bumps 4 are placed on connection terminals 12 formed on a substrate 2, a laser beam is applied to the whole rear surface of the integrated circuit chip 1 to bond a plurality of the solder bumps 4 to the respective connection terminals 12 simultaneously. For instance, the respective solder bumps 4 of the IC chip 1 are placed on the corresponding connection terminals 12. If the laser beam of a laser device 3 is converged into a shape same as the shape of the upper surface of the IC chip 1 by a scope 13 and converged by a condenser lens 14 and applied to the whole upper surface of the IC chip 1, the whole IC chip 1 is uniformly heated in a short time and the respective solder bumps 4 are melted simultaneously and uniformly and bonded to the respective connection terminals 12 of the substrate 2 simultaneously. |
