发明名称 MANUFACTURE OF RESIN SEALED TYPE SEMICONDUCTOR DEVICE
摘要 PURPOSE:To contrive improvements in workability and efficiency of an enclosing process, by a method wherein sealing with resin is performed after fixing of a sensor for detection of a curing state of the resin into a cavity of a mold to be used for sealing with the resin. CONSTITUTION:A lead frame to which pellets are stuck is placed between a top and bottom forces 8A, 8B and a sensor 3 comprised of a piezoelectric element is kept fixed within a cavity 6 of the bottom force 8B. After fixing of the forces 8A, 8B with a press 9, thermosetting resin tablets are put into the forces through a loading port provided in a plunger 7 and the inside of the cavity 6 is filled with the resin 5 by pressing down the plunger 7. At the time when the resin 5 is molded with pressure, a curing stage of the resin is detected by a plurality of the sensors 3 fitted to the cavity 6. With this information, the curing state of the resin is secured, and when the resin attains a designated curing level, instructions opening the forces 8A, 8B are imparted to a hydraulic valve 2 from a CPU 1.
申请公布号 JPH02128806(A) 申请公布日期 1990.05.17
申请号 JP19880283332 申请日期 1988.11.08
申请人 NEC YAMAGATA LTD 发明人 ISHII YASUHIKO
分类号 B29C33/00;B29C45/02;B29C45/14;B29C45/26;B29C45/76;B29L31/34;H01L21/56 主分类号 B29C33/00
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