The invention relates to a bonding device for joining components (30) by means of pressure, heat and a solder (6). The invention is based on the object of simplifying the solder distribution on the components (30) to be joined. According to the invention, the bonding device is equipped with a supply container (1) which, in its interior (1I), has liquid solder (6) which is deposited by means of a distributor (4) onto the surfaces of the components (30). <IMAGE>
