| 摘要 |
<p>A method of making integrated circuits provides for applying on a sublayer (1), according to a predetermined topology, of circuit elements in the form of pluralities (A, B, C, D) of points arranged in a predetermined coordinate system (x/y) and applied in the form of separate drops (2) of liquid application compounds. The pluralities (A, B, C, D) of points constitute the blank elements for the integrated circuit which are then subjected to heat treatment to obtain the desired integrated circuit. A device for implementing the method comprises consecutively located units (9, 10, 11) for application of liquid compounds provided with capillar nozzles (15) and located in a predetermined coordinate system (x/y), and electrically controlled means for selective shots of drops (2) of liquid application compounds through capillar nozzles (15) on a sublayer (1) placed on a unit (7) intended for fastening the sublayer (1) and mounted on a means (8) for moving the unit (7) for fastening the sublayer (1). The device further comprises a control unit (16) connected to electrically controlled means for selective shots of drops (2) and to a voltage pulse generator (21), a unit (12) for the heat treatment of the applied compounds and means (13) for drying the applied compounds which are located between said units.</p> |
