| 摘要 |
In order to connect a chip (5) containing optical components to a substrate (4), optical and electrical connecting elements (1, 8) are produced on a flexible intermediate carrier (2) and, after the film bonding process (which is known for purely electrical connections) are connected both to connecting elements of the chip and to conductor tracks or optical waveguides (3) on the substrate. If the optical connecting elements (1) are spatially arranged between the electrical connecting elements (8), they are held and adjusted by means of the solder connections (produced on both sides) of the electrical connecting elements. In addition to electrical test adapter connections, optical test loops, which connect optical inputs and outputs to one another and are eliminated in the subsequent stamping- out process, can be provided on the flexible intermediate carrier (2). …<IMAGE>… |
