METHOD AND APPARATUS FOR ALIGNING SOLDER BALLS,申请号EP19880112127-传众专利搜索

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发明名称	METHOD AND APPARATUS FOR ALIGNING SOLDER BALLS
摘要
申请公布号	EP0307591(A3)	申请公布日期	1990.10.03
申请号	EP19880112127	申请日期	1988.07.27
申请人	HITACHI, LTD.	发明人	FUKASAWA, HIDEYUKI;KOBAYASHI, MAMORU;WANAMI, MASAHIRO
分类号	H01L21/48;H01L21/60;H05K3/34;(IPC1-7):H01L21/60	主分类号	H01L21/48
代理机构		代理人
主权项
地址

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