发明名称 |
Semi-conductor device and method of manufacturing the same. |
摘要 |
<p>The invention provides a semi-conductor device and a method of manufacturing such a device. The method comprises providing a semi-conductor substrate (101) of a first conductivity type, forming a gate electrode on the semi-conductor substrate including a first conductive layer (103) and a second conductive layer (105) superposed thereon, and forming source/drain regions (106) by ion implanting impurities of a second conductivity type into the semi-conductor substrate. The step of forming the gate electrode includes thermal annealing in order to contract the second conductive layer relative to the first conductive layer. The semi-conductor device thus provided has a first conductive layer which has a length greater by a pre-determined amount than a length of the second conductive layer and which overlaps the source/drain regions by predetermined amounts.</p> |
申请公布号 |
EP0390509(A2) |
申请公布日期 |
1990.10.03 |
申请号 |
EP19900303269 |
申请日期 |
1990.03.28 |
申请人 |
SEIKO EPSON CORPORATION |
发明人 |
TAKEUCHI, MASAHIRO C/O SEIKO EPSON COPORATION |
分类号 |
H01L21/28;H01L21/336;H01L29/78 |
主分类号 |
H01L21/28 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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