发明名称 Semi-conductor device and method of manufacturing the same.
摘要 <p>The invention provides a semi-conductor device and a method of manufacturing such a device. The method comprises providing a semi-conductor substrate (101) of a first conductivity type, forming a gate electrode on the semi-conductor substrate including a first conductive layer (103) and a second conductive layer (105) superposed thereon, and forming source/drain regions (106) by ion implanting impurities of a second conductivity type into the semi-conductor substrate. The step of forming the gate electrode includes thermal annealing in order to contract the second conductive layer relative to the first conductive layer. The semi-conductor device thus provided has a first conductive layer which has a length greater by a pre-determined amount than a length of the second conductive layer and which overlaps the source/drain regions by predetermined amounts.</p>
申请公布号 EP0390509(A2) 申请公布日期 1990.10.03
申请号 EP19900303269 申请日期 1990.03.28
申请人 SEIKO EPSON CORPORATION 发明人 TAKEUCHI, MASAHIRO C/O SEIKO EPSON COPORATION
分类号 H01L21/28;H01L21/336;H01L29/78 主分类号 H01L21/28
代理机构 代理人
主权项
地址