Imide prepolymers, cured products, method for making the same, laminate preparation, and encapsulating compositions.

摘要

An imide prepolymer comprising specific bismaleimide and diamine components in a specific molar ratio cures into a product having improved dielectric properties, heat resistance, and bond strength. An encapsulating composition for semiconductor packages is obtained therefrom. The prepolymer is used to form prepregs from which laminates useful as multilayer printed circuit boards are manufactured.