发明名称 SEMICONDUCTOR DEVICE
摘要 PURPOSE:To cool the entire body at a uniform temperature and to stabilize the performance of a computer by utilizing the heat which is absorbed when a solid phase is transformed into a liquid phase, and cooling semiconductor devices. CONSTITUTION:A cooling medium within a container 10 is cooled to the freezing temperature or lower of the phase changing material in the cooling medium with a cooling coil 22A through which the refrigerant that is cooled with a refrigerator 22 flows. Droplets 5 which are the phase changing material are freezed, and minute solid-state particles 6 are obtained. The solid-state particles 6 are dispersed into liquid 4 whose phase is not changed. The cooling medium becomes the slurry-state cooling medium 2. The cooling medium flows through semiconductor devices 21 in a computor main body 11 by way of a motor operated valve 26 and Iiquid sending pipe 18. The slurry-state cooling medium 2 which flows through the semiconductor device 21 flows up from the lower part in a snake pattern. Heat generated from the semiconductor elements is absorbed with the cooling medium through a heat conducting member and a heat conducting surfaces. Thus, the heat generated in the computer is cooled highly efficiently at the uniform temperature of the part to be cooled.
申请公布号 JPH02246255(A) 申请公布日期 1990.10.02
申请号 JP19890067984 申请日期 1989.03.20
申请人 HITACHI LTD 发明人 KOSEKI YASUO;EBARA KATSUYA;TAKAHASHI SANKICHI;YOKOYAMA HIROSHI;MORIHARA ATSUSHI;NAGANUMA YOSHIO;ZUSHI SHIZUO
分类号 H01L23/373;F28D20/02;H01L23/473 主分类号 H01L23/373
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