| 摘要 |
PURPOSE:To detect abnormalities which break semiconductor chips by especially enlarging the output of a pressure detector at a region where concentrated pushing force is applied when a foreign matter is present, and differentiating the value from a value when there is no foreign matter. CONSTITUTION:A sucking surface 1c of a vacuum sucking collet 11 is divided into four regions. A pressure detector 1e which detects pushing force that is received from a semiconductor chip C is provided beneath a silicone rubber 1d forming the sucking surface 1c at each region. When there are the differences exceeding a specified value among the outputs of four pressure detectors 1e or when the outputs of one or more pressure detectors 1e exceed a specified value, it is judged that there is abnormality. This is detected when the collet 11 sucks the semiconductor chip C or when the collect 11 is compressed to a package P. Thus, the abnormality which breaks the semiconductor chip can be detected. |
