Process for seeding substrate with metal - comprises impregnating substrate with soln. of e.g. palladium salt, then irradiating with e.g. electrons

摘要

A process is described for `seeding' a substrate with a metal. This is the first stage of an electroless metallisation process in which the `seed' catalyses the deposition. The substrate is usefully (but not necessarily) a thermoplast or a semiconductor, whilst the seed is a noble metal esp. Pd, Pt, Au or Ag. First the substrate is impregnated with e.g. a soln. of a Pd salt (pref. satd.) e.g. (NH4)2PdCl4 contg. 1-100 g/l Pd (esp. 30-50 g/l) and then irradiated with electrons, other small particles, synchrotron output light of wavelength below 850 nm (esp. below 400 nm), light which is part or wholly in the UV region, or light with an energy density above 5 mJ/cm2.