POLYIMIDE AND HIGH-TEMPERATURE ADHESIVE OF POLYIMIDE

摘要

POLYIMIDE AND HIGH-TEMPERATURE ADHESIVE OF POLYMIDE This invention relates to a novel polyimide and describes method of its preparation, adhesives of the polyimide and the method for their application. The polyimide has recurring units of the formula (where R is a tetra-valent radical selected from the group consisting of aliphatic radical having not less than two carbons, cyclo-aliphatic radical, monoaromatic radical, condensed polyaromatic radical, and non condensed polyaromatic radical wherein aromatic radicals are mutually connected with a bond or a crosslinking function). The polyimide can be prepared by reacting 2,6-bis(3-amino-phenoxy)pyridine with tetracarboxylic dianhydride in an organic solvent and imidizing resultant polyamic acid. Various tetracarboxylic dianhydrides can be used and particularly prefered are pyromellitic dianhydride and 3,3',4,4'benzophenonetetracarboxylic dianhydride.