MODULAR PROCESSING APPARATUS FOR PROCESSING SEMICONDUCTOR WAFERS

摘要

A modular processing apparatus is constructed of a first chassis, a first module attached to the first chassis for performing at least one operation on a workpiece to be processed, a subassembly separate from the first chassis, service supply means attached to the subassembly for supplying a preselected service to the first module for the operation thereof, and connection means for releasably connecting the service supply means to the first module. The modular processing apparatus further includes transfer means attached to the first chassis for transferring the workpiece from the first module to a location remote therefrom for performing at least another operation on the workpiece, the first module and the transfer means being arranged asymmetric with respect to a diagonal axis of the first chassis whereby the distance between the first module and the transfer means is substantially equal to the distance between the transfer means and the location.