发明名称 GOSEIJUSHIHYOMENJONOKINZOKUPATAANKEISEIHOHO
摘要 PURPOSE:To form a metallic pattern available in the manufacture of a wiring board on the surface of resin with a simple operation by exposing cellulose fiber packed in a molded body of synthetic resin, immersing this in palladium hydrogel and thereafter performing electroless plating thereon. CONSTITUTION:Cellulose fiber is exposed according to a prescribed pattern from the surface of a molded body of synthetic resin such as phenolic resin and melamine resin which is uniformly packed with cellulose fiber such as paper and pulp. Therefor the resin may be cut, abraded and disconnected for example by using a cutter and a file of a hard material made of steel. After washing a molded body of synthetic resin wherein cellulose fiber is exposed in the prescribed part with an organic solvent such as ethanol and washing it with water, it is immersed in palladium hydrosol having 0.01-5mg-atom/l Pd concn. Normally for >=1 minute. Then after washing the resin molded body subjected to the immersion treatment with water, it is immersed in an electroless plating bath to form a metallic pattern on the resin molded body. In such a method, the metallic pattern can be formed on the resin molded body in a simple operation without using a resist and an etching operation.
申请公布号 JPH0243826(B2) 申请公布日期 1990.10.01
申请号 JP19850146228 申请日期 1985.07.03
申请人 KOGYO GIJUTSUIN 发明人 NAKAO YUKIMICHI;KAERYAMA KYOJI;SUDA MASAO
分类号 C23C18/20;C23C18/16;C23C18/30;C23C18/31;C23C18/32;C23C18/34;C23C18/40;H05K1/03;H05K3/18 主分类号 C23C18/20
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