| 摘要 |
In a method of forming an assembly in which a semiconductor element (1, 2) is secured on an insulating plate (3) which is surrounded by an insulating frame (5), the plate and the frame bear on a metal support (4) and a cover (9) is fixed over the frame. An initial step involves the formation of a subassembly (60) comprising the element (1, 2), the plate (3) and the frame (5), the element (1, 2) being secured on one of the metallized surfaces (30, 31) of the plate (3) and connected by means of connection wires (20A) to the frame. Subsequently the subassembly is attached to the support (4) and to the cover (9) by bonding rings 41, 40 of Au/Sn alloy. <IMAGE> |
