| 摘要 |
PURPOSE:To obtain a semiconductor, device where wires are not short-circuited, edges are not short-circuited and a disconnection is not caused by a method wherein a bonding pad of a semiconductor chip is fit to a fitting recessed part for chip use which has been formed in the central part on the surface of a die pad. CONSTITUTION:Parts on the side of bonding pads 5a of a semiconductor chip 5 are fit to a fitting recessed part 13 for chip use which has been formed in the central part on the surface of a die pad 12. The bonding pads 5a are bonded, by a pressurization operation, to bumps 13a for chip use which have been formed at peripheral edge sides at the bottom of the fitting recessed part 13 for chip use. Thereby, leads 4 are connected to the bonding pads 5a of the semiconductor chip 5 via their bumps 4a, electrodes 14 of the die pad 12, metal thin wires 14a and the bumps 13a for chip use. In this manner, this assembly is packaged and sealed with a synthetic resin. Since the bonding pads 5a are situated inside the fitting recessed part 13 for chip use of the die pad 12 during this sealing operation, they are not crushed by a stress of the sealing resin. |
