| 摘要 |
PURPOSE:To achieve improved inflammability and heat resistance even without mixing an inflammable agent by forming a substrate using a compound material obtained by dipping a highly pure resol-type phenol resin composition into a glass fiber and then curing it. CONSTITUTION:A semiconductor element 6 is mounted to a pin 7 for external wiring or a board 1 with leads and the electrode part of element and the lead formed on the substrate are electrically connected by a metal thin wire 4. Then, in a semiconductor device having a package structure of pin-grid array type which is packaged by a metal cover or/and resin composition 3, the board 1 consists of a compound material obtained by dipping a highly pure resol-type phenol resin composition to a glass fiber and then curing it, the electrical conductivity of a liquid extracted by heating the highly pure resol-type phenol resin in a pure water whose volume is then times as large as that of the resin at 120 deg.C for 100 hours or more is 100muS/cm or less, the pH is 3-7, and the halogen ions, alkali metal ions, and ammonium ions are 10ppm or less. |
