| 摘要 |
PURPOSE: To prevent formation of a solder lump and electric short-circuit and enable smooth solder coating by a method wherein a package assembly is rotated for a pallet and solder waves and is inclined. CONSTITUTION: A rectangular or square IC package 12 is rotated at a predetermined angle and an angular part faces solder waves 14. Further, it is fixed onto an inclined surface or a ramp 18 and is directed upward with respect to the solder waves 14. Accordingly, when the package 12 is moved by a conveyor, an adjacent side part is inclined with respect to a direction of advancing into solder waves and is made surfing movements via the solder waves 14 to be coated. Further, when a pallet 10 is escaped from the solder waves 14, excessive solder is dropped down and fed back to solder waves. As described above, the inclined and rotated package passes through the solder waves, so that it is possible to perform smooth solder coating without generating formation of a solder lump or electric short-circuit. |
