发明名称 |
ELECTROSTATIC CHUCK COATED WITH DIAMOND |
摘要 |
<p>PURPOSE: To provide an electrostatic chuck for holding a wafer which exhibits large durability in several environments, such as a high-temperature environment and a corrosive chemical environment. CONSTITUTION: An electrostatic chuck 10 includes a molybdenum-made body 14 which is large enough to support a semiconductor wafer 12. This body is coated with a 1st diamond layer 20 of 0.1 to 5.0μm. On this 1st diamond layer, a couple of molybdenum-made electrodes 22A and 22B in nearly flat shapes are formed. A 2nd diamond layer 44 which is almost as thick as the 1st diamond layer is formed uniformly in such a manner as covering the couple of electrodes. A voltage is applied between the couple of electrodes to generate an electrostatic force, thereby attracting and holding the wafer on the surface of the 2nd diamond layer.</p> |
申请公布号 |
JPH04277648(A) |
申请公布日期 |
1992.10.02 |
申请号 |
JP19910321794 |
申请日期 |
1991.12.05 |
申请人 |
INTERNATL BUSINESS MACH CORP <IBM> |
发明人 |
JIEEMUZU UIRIAMU RIPOREISU;JIEEMUZU ANSONII SEIAMARUKO |
分类号 |
B23Q3/15;G03F7/20;H01L21/683;H02N13/00 |
主分类号 |
B23Q3/15 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|