发明名称 ELECTROSTATIC CHUCK COATED WITH DIAMOND
摘要 <p>PURPOSE: To provide an electrostatic chuck for holding a wafer which exhibits large durability in several environments, such as a high-temperature environment and a corrosive chemical environment. CONSTITUTION: An electrostatic chuck 10 includes a molybdenum-made body 14 which is large enough to support a semiconductor wafer 12. This body is coated with a 1st diamond layer 20 of 0.1 to 5.0μm. On this 1st diamond layer, a couple of molybdenum-made electrodes 22A and 22B in nearly flat shapes are formed. A 2nd diamond layer 44 which is almost as thick as the 1st diamond layer is formed uniformly in such a manner as covering the couple of electrodes. A voltage is applied between the couple of electrodes to generate an electrostatic force, thereby attracting and holding the wafer on the surface of the 2nd diamond layer.</p>
申请公布号 JPH04277648(A) 申请公布日期 1992.10.02
申请号 JP19910321794 申请日期 1991.12.05
申请人 INTERNATL BUSINESS MACH CORP <IBM> 发明人 JIEEMUZU UIRIAMU RIPOREISU;JIEEMUZU ANSONII SEIAMARUKO
分类号 B23Q3/15;G03F7/20;H01L21/683;H02N13/00 主分类号 B23Q3/15
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